Maytinhcongnghiep
MIC-733-TS5A1
Fanless industrial edge AI computing system, NEMA TS2 compliant, withstanding a wide -34 to 74°C temperature range, with outstanding vibration/shock resistance and a built-in 500ms power interruption backup. Integrates an NVIDIA Jetson AGX Orin 32GB LPDDR5 processor dedicated to intelligent transportation and AI inference applications.
- NEMA TS2 compliant for intelligent transportation system applications
- Compact fanless design, 3Grms vibration and 10G shock resistance
- Supports a harsh operating temperature range from -34 to 74°C
- 500ms power interruption backup feature per NEMA TS2 standard
This is a reference range for the barebone unit, excluding RAM and storage. IPC247 engineers advise on a full configuration for your use case.
Industrial factors
| Operating temperature range | -34 ~ 74 °C (with 0.7 m/s airflow (in 30W AGX Orin mode)) |
|---|---|
| Power input | 12 VDC |
| Power connector | Terminal Block 4P |
| Mounting | Desktop, Wall mount |
| Dimensions (mm) | 192 x 290 x 87 |
| Weight (kg) | 4.5 |
| Vibration resistance | 3Grms @ 5 ~ 500 Hz — random, 1 hr/axis |
| Certifications | NEMA-TS2, CE, FCC |
Computing
| CPU | 8-core NVIDIA Arm Cortex A78AE v8.2 |
|---|---|
| RAM | LPDDR5 · up to 32GB |
| Storage | eMMC · M.2 2280 M-Key Slot (NVMe 512GB pre-installed) · Micro SD slot |
| GPU | NVIDIA Ampere GPU with 56 Tensor Cores |
| CUDA cores | 1792 |
| PCI/PCIe expansion slots | 0 |
Connectivity & I/O
| COM | 2× RS-232/422/485 (On-board pin header) |
|---|---|
| LAN | 4× 10/100/1000 Mbps PoE |
| USB | 2× USB USB 3.0 · 1× USB Micro USB OTG |
| DIO | 4 in / 4 out |
| Display outputs | 1× HDMI |
| Expansion | 2× mPCIe · 1× M.2 3052 B-Key · 1× TPM · 1× iDoor |
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Optional accessories & modules (25 items)
| 96FD80-P1TB-TS1 | SSSTC M.2 2280 1TB NVME G4x4 SSD -25°C ~85°C |
|---|---|
| SQF-C8MV4-1TDEDC | SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) |
| SQF-C8MV4-1TDEFM | SQF M.2 2280 730-D 1T 3D TLC BiCS5 (-20~85°C) |
| SQF-C8MZ2-128GDEDE | SQF M.2 2280 720-D 128G 3D sTLC BiCS5 (-40~85°C) |
| SQF-C8MV2-512GDEFE | SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-40~85°C) |
| SQF-C8MV2-512GDEFN | SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-20~85°C) |
| SQF-C8MV4-2TDEDC | SQF M.2 2280 720-D 2T 3D TLC BiCS5 (0~70°C) |
| SQF-C8MV2-128GDEDM | SQF M.2 2280 720-D 128G 3D TLC BiCS5 (-20~85°C) |
| SQF-C8MV2-512GDEDM | SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-20~85°C) |
| SQF-C8BV4-1TDEDC | SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) |
| EWM-W173H01E | Wi-Fi 6+BT 5.0 Module 2.4/5GHz Mini PCIe |
| EWM-W172H01E | Wi-Fi 5+BT 4.2 Module 2.4/5GHz Mini PCIe |
| 1751000626-01 | Cable Ant. SMA/F-R MHF1/113 BLK L250mm |
| 1751000717-01 | Dipole Ant.WiFi 6E SMA/M-R RG178 BLK L183mm IP67 |
| 1751000460-01 | Dipole Ant. WiFi 6E SMA/M-R BLK L111.7mm IP54 |
| 9656EWMG00E | Half-size miniPCIe to miniPCIe bracket set |
| AIW-356-DQ | 5G Sub6+GNSS M.2 3052 Key B (by region) |
| 1751000623-01 | Cable Ant. SMA/F MHF4L/113 BLK L300mm (5G) |
| 1750009372-01 | Ant.SMA/M 90/180 5G BLK 167mm RG178 (5G) |
| 1700029019-01 | Power Cord (PSE/BSMI), 3-pin, 7A, 125V, 1.8 M, DAC-ST01 |
| 98RV710AL00 | Allxon OOB module |
| 1700019968 | F Cable 2x10P-2.0/D-SUB 9P(M)x2 15CM for On-board serial ports pin header extension |
| 1960068789T008 | IDOOR COMX2 Cover for On-board serial ports pin header extension |
| 1960065854N021 | PCM series module bracket for supporting idoor cover fixing |
| PCA-TPMSPI-00A1 | TPM 2.0 Module by SPI interface |
Other configurations in the MIC-700 series
Same chassis, same mounting — they differ in screen size and CPU. If the model above isn’t quite right, switching to one of these is usually enough.
Equivalent products from other series
Different series — some even a different brand — but the same machine type with closely matching key specs. We cross-check compatibility against the manufacturer’s documentation before quoting.