MIC-733-TS5A1
Hệ thống máy tính xử lý AI biên công nghiệp không quạt, đạt chuẩn NEMA TS2, chịu dải nhiệt rộng -34 đến 74°C, chống rung xóc vượt trội và tích hợp nguồn điện sao lưu gián đoạn 500ms. Thiết bị tích hợp vi xử lý NVIDIA Jetson AGX Orin 32GB LPDDR5 chuyên dụng cho các ứng dụng giao thông thông minh và suy luận AI.
- Tuân thủ tiêu chuẩn NEMA TS2 ứng dụng trong hệ thống giao thông thông minh
- Thiết kế nhỏ gọn, không quạt, chống rung 3Grms và chống sốc 10G
- Hỗ trợ dải nhiệt độ hoạt động khắc nghiệt từ -34 đến 74°C
- Tính năng sao lưu nguồn gián đoạn 500ms theo chuẩn NEMA TS2
This is a reference range for the barebone unit, excluding RAM and storage. IPC247 engineers advise on a full configuration for your use case.
Industrial factors
| Operating temperature range | -34 ~ 74 °C (with 0.7 m/s airflow (in 30W AGX Orin mode)) |
|---|---|
| Power input | 12 VDC |
| Power connector | Terminal Block 4P |
| Mounting | Desktop, Wall mount |
| Dimensions (mm) | 192 x 290 x 87 |
| Weight (kg) | 4.5 |
| Vibration resistance | 3Grms @ 5 ~ 500 Hz — random, 1 hr/axis |
| Certifications | NEMA-TS2, CE, FCC |
Computing
| CPU | 8-core NVIDIA Arm Cortex A78AE v8.2 |
|---|---|
| RAM | LPDDR5 · up to 32GB |
| Storage | 1× eMMC · 1× M.2 2280 M-Key Slot (NVMe 512GB pre-installed) · 1× Micro SD slot |
| GPU | NVIDIA Ampere GPU with 56 Tensor Cores |
| CUDA cores | 1792 |
| PCI/PCIe expansion slots | 0 |
Connectivity & I/O
| COM | 2× RS-232/422/485 (On-board pin header) |
|---|---|
| LAN | 4× 10/100/1000 Mbps PoE |
| USB | 2× USB USB 3.0 · 1× USB Micro USB OTG |
| DIO | 4 in / 4 out |
| Display outputs | 1× HDMI |
| Expansion | 2× mPCIe · 1× M.2 3052 B-Key · 1× TPM · 1× iDoor |
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Optional accessories & modules (25 items)
| 96FD80-P1TB-TS1 | SSSTC M.2 2280 1TB NVME G4x4 SSD -25°C ~85°C |
|---|---|
| SQF-C8MV4-1TDEDC | SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) |
| SQF-C8MV4-1TDEFM | SQF M.2 2280 730-D 1T 3D TLC BiCS5 (-20~85°C) |
| SQF-C8MZ2-128GDEDE | SQF M.2 2280 720-D 128G 3D sTLC BiCS5 (-40~85°C) |
| SQF-C8MV2-512GDEFE | SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-40~85°C) |
| SQF-C8MV2-512GDEFN | SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-20~85°C) |
| SQF-C8MV4-2TDEDC | SQF M.2 2280 720-D 2T 3D TLC BiCS5 (0~70°C) |
| SQF-C8MV2-128GDEDM | SQF M.2 2280 720-D 128G 3D TLC BiCS5 (-20~85°C) |
| SQF-C8MV2-512GDEDM | SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-20~85°C) |
| SQF-C8BV4-1TDEDC | SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) |
| EWM-W173H01E | Wi-Fi 6+BT 5.0 Module 2.4/5GHz Mini PCIe |
| EWM-W172H01E | Wi-Fi 5+BT 4.2 Module 2.4/5GHz Mini PCIe |
| 1751000626-01 | Cable Ant. SMA/F-R MHF1/113 BLK L250mm |
| 1751000717-01 | Dipole Ant.WiFi 6E SMA/M-R RG178 BLK L183mm IP67 |
| 1751000460-01 | Dipole Ant. WiFi 6E SMA/M-R BLK L111.7mm IP54 |
| 9656EWMG00E | Half-size miniPCIe to miniPCIe bracket set |
| AIW-356-DQ | 5G Sub6+GNSS M.2 3052 Key B (by region) |
| 1751000623-01 | Cable Ant. SMA/F MHF4L/113 BLK L300mm (5G) |
| 1750009372-01 | Ant.SMA/M 90/180 5G BLK 167mm RG178 (5G) |
| 1700029019-01 | Power Cord (PSE/BSMI), 3-pin, 7A, 125V, 1.8 M, DAC-ST01 |
| 98RV710AL00 | Allxon OOB module |
| 1700019968 | F Cable 2x10P-2.0/D-SUB 9P(M)x2 15CM for On-board serial ports pin header extension |
| 1960068789T008 | IDOOR COMX2 Cover for On-board serial ports pin header extension |
| 1960065854N021 | PCM series module bracket for supporting idoor cover fixing |
| PCA-TPMSPI-00A1 | TPM 2.0 Module by SPI interface |
Other configurations in the MIC-700 series
Same chassis, same mounting — they differ in screen size and CPU. If the model above isn’t quite right, switching to one of these is usually enough.
Equivalent products from other series
Different series — some even a different brand — but the same machine type with closely matching key specs. We cross-check compatibility against the manufacturer’s documentation before quoting.